Thermal Interface Material Pad
Bergquist gap pad tgp 10000ulm is a formulation that provides exceptionally high thermal conductivity of.
Thermal interface material pad. In computing and electronics thermal pads also called thermally conductive pad or thermal interface pad are pre formed rectangles of solid material often paraffin wax or silicone based commonly found on the underside of heatsinks to aid the conduction of heat away from the component being cooled such as a cpu or another chip and into the heatsink usually made from aluminium or copper. These accessories serve purposes such as ensuring efficient airflow between the fan and the components. Protection between the fan blades and foreign objects and thermal conductivity between devices. Thermal interface material tim stockwell elastomerics uses thermal interface materials tims to make thermally conductive silicone pads and thermal gap fillers used for heat transfer in electronic devices and packaging applications with silicone thermal interface materials from bergquist saint gobain and 3m.
Laird s extensive gap filler product lines includes a wide range of. Fans utilize numerous accessories when installed properly including finger guards thermal pads brackets cords filters and filter guards. Resolve dry out cracking and silicone migration issues by replacing mica and thermal grease applications with cleaner and reproducible rubber materials. Laird gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system.
This makes thermal pads an ideal reusable thermal interface material.